General
-
Aluminium Oxide (Al2O3 ) or alumina is one of the
most versatile of refractory ceramic oxides and finds use in a wide
range of applications.
-
It
is found in nature as corundum in emery, topaz, amethyst, and emerald
and as the precious gemstones ruby and sapphire, but it is from the more
abundant ores such as bauxite, cryolite and clays that the material is
commercially extracted and purified.
Production
Process
- The most common
process for the extraction and purification of alumina is the ‘Bayer’
process. The yield of alumina from these processes can approach 90%.
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Through a series of chemical baths, ground
aluminum substrates are plated with a nickel phosphorus ("NiP") layer in
order to provide support for the magnetic layer.
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A modified Ziegler alcohol process produces high
purity gels, derived from aluminum metal. This manufacturing process for
these products begins with primary aluminum to produce an alumina of
extraordinary purity.
Applications
- This high
grade alumina substrate is applied for thin film integrated circuit in
high frequency waves, capacitor or resistor and for sensors.
- Alumina is used as
milling media in a wide range of particle size reduction processes.
- IRC has developed an
aluminum alloy substrate for surface mounted LEDs using an aluminum core
with a chemically grown dielectric layer and printed conductor tracks.
This technique produces an insulated, yet thermally conductive PC board
with extremely low thermal resistance from the die or chip to the
substrate in power LED applications.
Technology
-
EMC Technology introduces an entire
line of new surface mount (SMT) alumina chip terminations made with the
telecom market in mind. These terminations can be used in applications
from DC to 3 GHz and are ideal for Cellular, GSM, PCS, and UMTS
applications.
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Application of alumina ceramics can be
greatly enhanced and fabrication costs reduced if simple and reliable
joining techniques are developed.
Report
- The sensor is
fabricated by screen printing three distinct materials on an alumina
substrate.
- It is reported that
diffusion resistance in the Vycor layer can be reduced by depositing a
thin Vycor layer (10-20 pm thick) onto a macroporous alumina support
tube, followed by sequential CVD of silica precursors.
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